A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...

Glass substrates are gaining attention as a structural alternative to organic build-up films/cores in advanced semiconductor ...

Atomic force microscopy (AFM) shows the surface of the TaC thin film before and after annealing at high temperatures. The initial film surface is composed of many columnar grains, whereas after ...

(Nanowerk News) Electronic waste, or e-waste, is a rapidly growing global problem, and it’s expected to worsen with the production of new kinds of flexible electronics for robotics, wearable devices, ...

Thin film electronics on flexible substrates is a rapidly evolving technology that has the potential to revolutionize various industries, including healthcare, consumer electronics, and aerospace.

What’s driving change: Rising power densities in AI, HPC, and 5G demand substrates with exceptional thermal conductivity and mechanical strength. Material innovations: Advances include diamond-copper ...

Built from Kyocera’s proprietary Fine Ceramic materials, the substrate is engineered for high‑density wiring and exceptional ...

All of the wondrous gadgets and gizmos that have built the modern technological world come with a major drawback—they eventually end up in the trash. E-waste has been a growing problem for years, and ...

A new material for flexible electronics could enable multilayered, recyclable electronic devices and help limit e-waste. Electronic waste, or e-waste, is a rapidly growing global problem, and it's ...